| GLANZOX 系列抛光液 |
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| GLANZOX 系列抛光液是专用于硅芯片的抛光液，随着近年来的硅组件电路的发展，对硅芯片面精度的要求已越来越严格。而 GLANZOX 系列产品正是针对硅芯片抛光所发展出来的产品。 |
| Principal physical and performance characteristics of GLANZOX |
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SP - 30
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HP - 20
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3000
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7008HI
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3900
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3900RS |
Main component
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SiO2
(Colloidal)
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Super-pure
SiO2
(Colloidal)
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SiO2
(Colloidal)
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SiO2
(Colloidal)
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Super-pure
SiO2
(Colloidal)
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Super-pure
SiO2
(Colloidal)
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SiO2
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30
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17.5
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9.1
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9.1
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9.1
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9.1 |
PH
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11.5
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11.4
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10.8
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10.5
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10.5
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10.5 |
Specific gravity
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1.20
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1.11
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1.05
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1.05
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1.05
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1.05 |
Average particle size(nm)
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10 ~ 20
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30 ~ 40
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62 ~ 82
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30 ~ 40
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30 ~ 40 |
30 ~ 40 |
Polishing rate(μm/min)
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0.5 ~ 1.0
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0.8 ~ 1.4
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─
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─ |
─ |
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Application
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For first and second polishing
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For final polishing |
Standard packaging
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2kg plastic bottle
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20kg cubitain |
※ * Drum packing is available. |
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| COMPOL 系列抛光液 |
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| COMPOL 系列抛光液主要由高纯度的胶态氧化硅微粒所组成，可避免加工组件产生刮伤的现象。特别适用于铌酸锂、钽酸锂、蓝宝石、石英等电子材料、光学晶体、金属等抛光。 |
| Principal physical characteristics and applications of COMPOL |
Type |
20 |
50 |
80 |
120 |
EX- Ⅱ |
EX-3 |
50S |
50AD |
SiO2 含量( % ) |
40 |
40 |
40 |
40 |
30 |
30 |
50 |
50 |
PH |
9.2 |
10.2 |
10.2 |
9.2 |
9.8 |
9.5 |
11.0 |
11.0 |
比重 |
1.30 |
1.30 |
1.30 |
1.30 |
1.205 |
1.385 |
1.375 |
1.375 |
平均粒径 (nm) |
15.0 |
40.0 |
72.0 |
82.5 |
51.0 |
32.5 |
35.0 |
30.0 |
研磨速度(μm/min) |
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0.8~1.4 |
-- |
-- |
-- |
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-- |
-- |
应用 |
Sapphire, CaF2, BGO, LiTaO3 and other oxides |
|
si
(for first polishing) |
si
(for second polishing) |
包装 ( 20kg ) |
20 |
20 |
20 |
20 |
18 |
20 |
20 |
20 |
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